In this paper, a review is made of the possibilities of using polymer composites based on carbon fiber to increase thermal conductivity and electromagnetic interference (EMI) shielding. Overheating and the appearance of EMI are the results of a growing tendency towards a decrease in the size of boards and an increase in the functionality of devices with the development of modern radio electronics. This greatly affects the stability of the device itself and the service life of its electronic components. The paper discusses the topic of maintaining the solidity of the device case and the simultaneous protection from EMF due to it. The most relevant for use, with high thermal and electrical conductivity, low weight, and the possibility of quantitative control, is the use of carbon fiber composites.