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Planning Technology for Preparing High-Entropy Alloys (Solders) of the Cu-Ga-Pb-Sn-Bi System
Research output
:
Contribution to journal
›
Article
›
peer-review
Department of Physics
Center for Studies in Physics of Metallic Liquids
Department of Health and Safety
Institute of Material Science and Metallurgy
Institute of Fundamental Education
Institute of New Materials and Technologies
Overview
Cite this
DOI
https://doi.org/10.1007/s11015-015-0123-4
Final published version
O. A. Chikova
V. S. Tsepelev
V. V. V'yukhin
K. Yu. Shmakova
Original language
English
Pages (from-to)
435-440
Number of pages
6
Journal
Metallurgist
Volume
59
Issue number
5-6
DOIs
https://doi.org/10.1007/s11015-015-0123-4
Publication status
Published -
Sept 2015
Level of Research Output
VAK List
Research areas
melt, viscosity, wetting angle, spreading, structural state
WoS ResearchAreas Categories
Metallurgy & Metallurgical Engineering
ASJC Scopus subject areas
Condensed Matter Physics
Metals and Alloys
Mechanics of Materials
Materials Chemistry
ID: 546253
