Standard

Laser Triangulation 2D Scanner Signal Processing for Premium Thread Pitch Measurement. / Lavrinov, D. S.; Khorkin, A.
2017 International Conference on Industrial Engineering, Applications and Manufacturing, ICIEAM 2017 - Proceedings. Institute of Electrical and Electronics Engineers Inc., 2017. 8076110.

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

Harvard

Lavrinov, DS & Khorkin, A 2017, Laser Triangulation 2D Scanner Signal Processing for Premium Thread Pitch Measurement. in 2017 International Conference on Industrial Engineering, Applications and Manufacturing, ICIEAM 2017 - Proceedings., 8076110, Institute of Electrical and Electronics Engineers Inc., 2017 International Conference on Industrial Engineering, Applications and Manufacturing, ICIEAM 2017, Chelyabinsk, Russian Federation, 16/05/2017. https://doi.org/10.1109/ICIEAM.2017.8076110

APA

Lavrinov, D. S., & Khorkin, A. (2017). Laser Triangulation 2D Scanner Signal Processing for Premium Thread Pitch Measurement. In 2017 International Conference on Industrial Engineering, Applications and Manufacturing, ICIEAM 2017 - Proceedings [8076110] Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ICIEAM.2017.8076110

Vancouver

Lavrinov DS, Khorkin A. Laser Triangulation 2D Scanner Signal Processing for Premium Thread Pitch Measurement. In 2017 International Conference on Industrial Engineering, Applications and Manufacturing, ICIEAM 2017 - Proceedings. Institute of Electrical and Electronics Engineers Inc. 2017. 8076110 doi: 10.1109/ICIEAM.2017.8076110

Author

Lavrinov, D. S. ; Khorkin, A. / Laser Triangulation 2D Scanner Signal Processing for Premium Thread Pitch Measurement. 2017 International Conference on Industrial Engineering, Applications and Manufacturing, ICIEAM 2017 - Proceedings. Institute of Electrical and Electronics Engineers Inc., 2017.

BibTeX

@inproceedings{790c5472ef2e475baea0160e4602e39b,
title = "Laser Triangulation 2D Scanner Signal Processing for Premium Thread Pitch Measurement",
keywords = "Laser triangulation, scanner, digital image processing, thread measurement, gradient mask, characteristic of accuracy, DISPLACEMENT SENSOR",
author = "Lavrinov, {D. S.} and A. Khorkin",
year = "2017",
doi = "10.1109/ICIEAM.2017.8076110",
language = "English",
booktitle = "2017 International Conference on Industrial Engineering, Applications and Manufacturing, ICIEAM 2017 - Proceedings",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
address = "United States",
note = "2017 International Conference on Industrial Engineering, Applications and Manufacturing, ICIEAM 2017 ; Conference date: 16-05-2017 Through 19-05-2017",

}

RIS

TY - GEN

T1 - Laser Triangulation 2D Scanner Signal Processing for Premium Thread Pitch Measurement

AU - Lavrinov, D. S.

AU - Khorkin, A.

PY - 2017

Y1 - 2017

KW - Laser triangulation

KW - scanner

KW - digital image processing

KW - thread measurement

KW - gradient mask

KW - characteristic of accuracy

KW - DISPLACEMENT SENSOR

UR - http://www.scopus.com/inward/record.url?scp=85039954638&partnerID=8YFLogxK

UR - https://gateway.webofknowledge.com/gateway/Gateway.cgi?GWVersion=2&SrcAuth=tsmetrics&SrcApp=tsm_test&DestApp=WOS_CPL&DestLinkType=FullRecord&KeyUT=000414282400003

U2 - 10.1109/ICIEAM.2017.8076110

DO - 10.1109/ICIEAM.2017.8076110

M3 - Conference contribution

BT - 2017 International Conference on Industrial Engineering, Applications and Manufacturing, ICIEAM 2017 - Proceedings

PB - Institute of Electrical and Electronics Engineers Inc.

T2 - 2017 International Conference on Industrial Engineering, Applications and Manufacturing, ICIEAM 2017

Y2 - 16 May 2017 through 19 May 2017

ER -

ID: 6180805