The polytherms of kinematic viscosity of amorphous solder, based on STEMET 1101 Cu alloy are studied. The advantages of solder amorphous bands include avoidance of binder upon brazing and absence of associated phases as well as high strength and plasticity. The latter and small thickness of band enable to assembly the workpieces with the complicated configuration. New temperature regimes are suggested for solder producing by using the data on temperature dependence of viscosity of the said Cu-based alloy. Differential thermal analysis showed that the heat release upon crystallization of amorphous band, produced by new technology, is 20% more than band, produced by serial technology.